วันเสาร์ที่ 21 กุมภาพันธ์ พ.ศ. 2558

Minor Project


Minor Project

            My research question is whether type of amine curing agent is affecting curing temperature of epoxy system for read-write head in hard disk drive (HDD). The amine curing agent is an important component in epoxy adhesive because it induces the curing reaction and continues to complete reaction. However, there are several types of amine curing agents and they affect the curing temperature. Therefore, the amines are studied in order to formulate the epoxy adhesive whose curing temperature is match with temperature of process in HDD production.

            Researchers who have looked at this subject are Tanmoy Maity and Hongyang Cai. The former formulated epoxy adhesive with aromatic amine and the latter used aliphatic amine as curing agent.

            Maity et al (2007) reports that the curing behavior of epoxy adhesive with aromatic amine curing agents is investigated by differential scanning calorimetry (DSC) analysis. The curing temperature is widely about 150 – 210oC.

            Cai et al (2008) reports that the DSC thermograms of aliphatic amine-epoxy systems show the curing temperature about 115 – 125oC. This temperature is lower and narrower than results of Maity because the structure of aliphatic amines is more mobility than structure of aromatic amines at the same temperature.

            Debate centers on the basic issue of process temperature. The epoxy adhesive can be react if the temperature of production is not less than curing temperature of epoxy system.

            My work will be closer to the research of Cai et al (2008) because the temperature of production is 120 – 130oC and the curing temperature of aliphatic amine-epoxy systems is about 115 – 125oC. Moreover, the temperature of production should not be more than 150oC because the read-write head will be damaged at high temperature.

            Finally, I expect my contribution will be the way to choose and formulate the amine-epoxy systems whose the curing reaction is appropriate for HDD production in order to increase the productivity and especially reduce any problem during operation. (318 words)

Reference List
Cai, H., Li, P., Sui, G., Yu, Y., Li, G., Yang, X., Ryu, S. (2008). Curing kinetics study 
               of epoxy resin/flexible amine toughness systems by dynamic and isothermal 
               DSC. Thermochimica Acta, 473, 101-105.
Maity, T., Samanta, B.C., Dalai, S., Banthia, A.K. (2007). Curing study of epoxy
              resin by new aromatic amine functional curing agents along with
              mechanical and thermal evaluation. Materials Science and
              Engineering: A
, 464, 38-46.

11 ความคิดเห็น:

  1. Comment on friend' blogs:
    #1 suwatthikul.blogspot.com

    http://suwatthikul.blogspot.com/2015/02/minor-project.html?showComment=1424796617543#c2528069529233974256

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  2. ความคิดเห็นนี้ถูกผู้เขียนลบ

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  3. Maity et al (2007) reports and Cai et al (2008) reports I think you should you 'reported'.

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  4. In the second paragraph, i think you should change "Tanmoy Maity and Hongyang Cai" to "Maity et al. and Cai et al." because they did not do this alone.

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  5. I think that references in APA style should be edit to...
    1. Cai, H., Li, P., Sui, G., Yu, Y., Li, G., Yang, X., & Ryu, S. (2008). Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC. Thermochimica Acta, 473(1-2), 101-105.
    2. Maity, T., Samanta, B., Dalai, S., & Banthia, A. (2007). Curing study of epoxy resin by new aromatic amine functional curing agents along with mechanical and thermal evaluation. Materials Science And Engineering: A, 464(1-2), 38-46.

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  6. I think "the structure of aliphatic amines is more..." should be "the structure of aliphatic amines was more..."

    I'm not sure :)

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  7. Comment on friend' blogs:
    #2 faithanya.blogspot.com

    http://faithanya.blogspot.com/2015/02/minor-project.html?showComment=1424797351688#c1501896081051215590

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